Paul S. Ho
Author detail
Bookitis has not yet captured a biography for this author, but the catalog links below show the books currently associated with this profile.
Overview
Catalog identity and bibliographic footprint for this author.
Catalog identity
How this author appears inside the active Bookitis catalog.
Display name
Source identifier
Featured books
Representative editions for works actually authored by this person.
- Image source: Open LibraryAI
Advanced interconnects for ULSI technology
cover - Image source: Open LibraryLD
Low Dielectric Constant Materials for IC Applications
cover - Image source: Open LibraryLC
Low-dielectric constant materials IV
cover - Image source: Open LibraryMR
Materials Reliability in Microelectronics III
cover - Image source: Open LibraryEP
Electronic Packaging Materials Science V Vol. 203
cover - EIElectromigration in MetalsPaul S. Ho
Electromigration in Metals
no cover - EPElectronic Packaging Materials...Paul S. Ho
Electronic Packaging Materials Science V
no cover - SMSilicon MaterialsPaul S. Ho
Silicon Materials
no cover - EPElectronic Packaging Materials...Paul S. Ho
Electronic Packaging Materials Science VI
no cover - TFThin Films and Interfaces (Mate...Paul S. Ho
Thin films and interfaces
no cover
Works in catalog
Quick navigation into the work-level grouping pages behind the featured books.
- Open Work
Advanced interconnects for ULSI technology
- Open Work
Low Dielectric Constant Materials for IC Applications
- Open Work
Low-dielectric constant materials IV
- Open Work
Materials Reliability in Microelectronics III
- Open Work
Electronic Packaging Materials Science V Vol. 203
- Open Work
Electromigration in Metals
- Open Work
Electronic Packaging Materials Science V
- Open Work
Silicon Materials
- Open Work
Electronic Packaging Materials Science VI
- Open Work
Thin films and interfaces