Ipc
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Bookitis has not yet captured a biography for this author, but the catalog links below show the books currently associated with this profile.
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Featured books
Representative editions for works actually authored by this person.
- IJIPC/JEDEC J-STD-033D-JP Handlin...Ipc
IPC/JEDEC J-STD-033D-JP Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices (Japanese)
no cover - ISIPC-J-STD-001HS-CN Space and Mi...Ipc
IPC-J-STD-001HS-CN Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies
no cover - IMIPC/JEDEC-J-STD-020E-JP Moistur...Ipc
IPC/JEDEC-J-STD-020E-JP Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices (Japanese)
no cover - ISIPC-4412C Specification for Fin...Ipc
IPC-4412C Specification for Finished Fabric Woven from e Glass for Printed Boards
no cover - IRIPC-1755A-AM1 Responsible Sourc...Ipc
IPC-1755A-AM1 Responsible Sourcing of Minerals Data Exchange Standard
no cover - IGIPC-9709A Guidelines for Acoust...Ipc
IPC-9709A Guidelines for Acoustic Emission Measurement Method During Mechanical Testing
no cover - IAIPC-6012EA Automotive Applicati...Ipc
IPC-6012EA Automotive Applications Addendum to IPC-6012E Qualification and Performance Specification for Rigid Printed Boards
no cover - IAIPC-A-610H-CZ Acceptability of...Ipc
IPC-A-610H-CZ Acceptability of Electronic Assemblies (Czech)
no cover - IAIPC-A-610H-NL Acceptability of...Ipc
IPC-A-610H-NL Acceptability of Electronic Assemblies (Dutch)
no cover
Works in catalog
Quick navigation into the work-level grouping pages behind the featured books.
- Open Work
IPC/JEDEC J-STD-033D-JP Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices (Japanese)
- Open Work
IPC-J-STD-001HS-CN Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies
- Open Work
IPC/JEDEC-J-STD-020E-JP Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices (Japanese)
- Open Work
IPC-4412C Specification for Finished Fabric Woven from e Glass for Printed Boards
- Open Work
IPC-1755A-AM1 Responsible Sourcing of Minerals Data Exchange Standard
- Open Work
IPC-9709A Guidelines for Acoustic Emission Measurement Method During Mechanical Testing
- Open Work
IPC-6012EA Automotive Applications Addendum to IPC-6012E Qualification and Performance Specification for Rigid Printed Boards
- Open Work
IPC-A-610H-CZ Acceptability of Electronic Assemblies (Czech)
- Open Work
IPC-A-610H-NL Acceptability of Electronic Assemblies (Dutch)