Manufacturing Challenges in Electronic Packaging

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Manufacturing Challenges in Electronic Packaging

Y. C. Lee

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Cover for Manufacturing Challenges in Electronic Packaging

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Y. C. LeePublished 1998cover on file

This book provides a single source reference that addresses both advanced packaging and manufacturing activities, enhanced by reviews and in-depth analysis. The common theme throughout the book is how to manufacture with only one defective package in a million escaping undetected. The book will become the most important reference for professionals who need to meet this goal through their design and manufacturing activities.

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Publisher	Springer US
Pages	261
Format	[electronic resource] /
Search language	english
ISBN_10	1-461-37659-9 primary
ISBN_10	1-461-55803-4 primary
ISBN_13	978-1-461-37659-0 primary
ISBN_13	978-1-461-55803-3 primary

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