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Marin Alexe
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
| Publisher | Springer Berlin / Heidelberg |
|---|---|
| Pages | 504 |
| Format | [electronic resource] : |
| Search language | simple |
| ISBN_10 | 3-642-05915-5 primary |
| ISBN_10 | 3-662-10827-5 primary |
| ISBN_13 | 978-3-642-05915-5 primary |
| ISBN_13 | 978-3-662-10827-7 primary |
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