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Wilson Chin, Tao Lu, Xiaofei Qin, Yongren Feng, Yanmin Zhou
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| Publisher | Wiley & Sons, Incorporated, John |
|---|---|
| Search language | english |
| ISBN_13 | 978-1-119-28340-9 primary |
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Supercharge, Invasion, and Mudcake Growth in Downhole Applications
Supercharge, Invasion, and Mudcake Growth in Downhole Applications
Supercharge, Invasion, and Mudcake Growth in Downhole Applications