Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement

Yue Ma, Christian Gontrand

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Power, Thermal, Noise, and Signal Integrity Issues on Substrat...Yue Ma, Christian Gontrand

Yue Ma, Christian GontrandPublished 2019

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Publisher	Taylor & Francis Group
Pages	226
Search language	english
ISBN_13	978-0-429-39961-9 primary

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Publication-specific alternatives linked to the same work.

Power, Thermal, Noise, and Sign...Yue Ma, Christian Gontrand
PT
Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement
Yue Ma, Christian Gontrand | Taylor & Francis Group | 2019
Power, Thermal, Noise, and Sign...Yue Ma, Christian Gontrand
PT
Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement
Yue Ma, Christian Gontrand | Taylor & Francis Group | 2019
Power, Thermal, Noise, and Sign...Yue Ma, Christian Gontrand
PT
Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement
Yue Ma, Christian Gontrand | Taylor & Francis Group | 2019