Substrate Interconnects Noise Immunity and Electro-Thermal Analysis in Bulk Silicon Technology for Three-dimensional Circuits

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Substrate Interconnects Noise Immunity and Electro-Thermal Analysis in Bulk S...

Yue MaChristian Gontrand1 editions

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Yue Ma
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Christian Gontrand
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Substrate Interconnects Noise I...Yue Ma, Christian Gontrand
SI
Substrate Interconnects Noise Immunity and Electro-Thermal Analysis in Bulk Silicon Technology for Three-dimensional Circuits
Yue Ma, Christian Gontrand | Taylor & Francis Group | 2019