Failure Modes and Mechanisms in Electronic Packages

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Puligandla ViswanadhamP. Singh2 editions

With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and the prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers, and PCB assemblies.

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2 credited authorsSearch language english

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Puligandla Viswanadham
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P. Singh
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