Join BookitisSave favorites, build lists, and follow creators.
Log InCreate Account

Modeling and Simulation for Microelectronic Packaging Assembly

Work detail

Bookitis Pick
Modeling and Simulation for Microelectronic Packaging Assembly
MA
Liu, YongSheng Liu4 editions

This page groups all known editions belonging to the same underlying work.

Search booksOpen lead author

Overview

Shared work-level identity and catalog context.

2 credited authorsSearch language english

Bookitis keeps work pages focused on the shared book identity and the editions that actually belong to it. Unrelated books should not appear here as primary content.

Contributors

People credited with this work in the active catalog.

  • Liu, Yong

    Author profile in the active Bookitis catalog

    Open Author

  • Sheng Liu

    Author profile in the active Bookitis catalog

    Open Author

Editions

Publication-specific versions linked to this work only.