Wafer-Level Chip-Scale Packaging
Work detail
Bookitis Pick
WC
Image source: Open LibraryLiu, YongShichun Qu4 editions
This page groups all known editions belonging to the same underlying work.
Overview
Shared work-level identity and catalog context.
2 credited authorsSearch language english
Contributors
People credited with this work in the active catalog.
- Open Author
Liu, Yong
- Open Author
Shichun Qu
Editions
Publication-specific versions linked to this work only.