Advances in CMP/polishing technologies for the manufacture of electronic devices

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Advances in CMP/polishing technologies for the manufacture of electronic devices

Toshiro K. Doi, Ioan D. Marinescu, Syuhei Kurokawa

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Toshiro K. Doi, Ioan D. Marinescu, Syuhei KurokawaPublished 2012cover on file

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. --P. 4 of cover.

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Publisher	Elsevier, William Andrew
Pages	317
Search language	english
ISBN_10	1-437-77859-3 primary
ISBN_13	978-1-437-77859-5 primary

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