Join BookitisSave favorites, build lists, and follow creators.
Log InCreate Account

Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines

Work detail

Bookitis Pick
Cover for Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines
IC
Image source: Open Library
Michael PechtFirst published 19941 editions

This page groups all known editions belonging to the same underlying work.

Search booksOpen lead author

Overview

Shared work-level identity and catalog context.

First publish date March 1, 19941 credited authorSearch language english

Bookitis keeps work pages focused on the shared book identity and the editions that actually belong to it. Unrelated books should not appear here as primary content.

Contributors

People credited with this work in the active catalog.

  • Michael Pecht

    Author profile in the active Bookitis catalog

    Open Author

Editions

Publication-specific versions linked to this work only.