Michael Pecht
Michael Pecht
Bookitis has not yet captured a biography for this author, but the catalog links below show the books currently associated with this profile.
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Featured books
Representative editions for works actually authored by this person.
- Image source: Open LibraryKE
Korean Electronics Industry
cover - Image source: Open LibraryRE
Reliability Engineering
cover - Image source: Open LibraryPM
Product Maintainability Supportability Handbook
cover - Image source: Open LibraryPR
Product reliability, maintainability, and supportability handbook
cover - Image source: Open LibraryET
Encapsulation technologies for electronic applications
cover - Image source: Open LibraryPA
Prognostics and health management of electronics
cover - Image source: Open LibraryCE
China's electronics industry
cover - Image source: Open LibraryCE
China's Electronics Industry
cover - Image source: Open LibraryLE
Lead-free electronics
cover - Image source: Open LibraryPS
Parts Selection and Management
cover - Image source: Open LibraryIC
IC component sockets
cover - Image source: Open LibraryCO
Contamination of electronic assemblies
cover - Image source: Open LibraryEP
Electronic packaging materials and their properties
cover - Image source: Open LibraryGF
Guidebook for managing silicon chip reliability
cover - Image source: Open LibraryTC
The Chinese electronics industry
cover - Image source: Open LibraryTJ
The Japanese electronics industry
cover - Image source: Open LibraryTK
The Korean electronic industry
cover - Image source: Open LibraryAR
Advanced routing of electronic modules
cover - Image source: Open LibraryPR
Product reliability, maintainability, and supportability handbook
cover - Image source: Open LibraryPM
Plastic-encapsulated microelectronics
cover - Image source: Open LibraryIC
Integrated circuit, hybrid, and multichip module package design guidelines
cover - Image source: Open LibraryIC
Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines
cover - Image source: Open LibraryPA
Physical architecture of VLSI systems
cover - Image source: Open LibraryQC
Quality Conformance and Qualification of Microelectronic Packages and Interconnects
cover
Works in catalog
Quick navigation into the work-level grouping pages behind the featured books.
- Open Work
Korean Electronics Industry
- Open Work
Reliability Engineering
- Open Work
Product Maintainability Supportability Handbook
- Open Work
Product reliability, maintainability, and supportability handbook
- Open Work
Encapsulation technologies for electronic applications
- Open Work
Prognostics and health management of electronics
- Open Work
China's electronics industry
- Open Work
China's Electronics Industry
- Open Work
Lead-free electronics
- Open Work
Parts Selection and Management
- Open Work
IC component sockets
- Open Work
Contamination of electronic assemblies
- Open Work
Electronic packaging materials and their properties
- Open Work
Guidebook for managing silicon chip reliability
- Open Work
The Chinese electronics industry
- Open Work
The Japanese electronics industry
- Open Work
The Korean electronic industry
- Open Work
Advanced routing of electronic modules
- Open Work
Product reliability, maintainability, and supportability handbook
- Open Work
Plastic-encapsulated microelectronics
- Open Work
Integrated circuit, hybrid, and multichip module package design guidelines
- Open Work
Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines
- Open Work
Physical architecture of VLSI systems
- Open Work
Quality Conformance and Qualification of Microelectronic Packages and Interconnects