Electronic packaging materials and their properties

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Michael PechtF. Patrick McCluskeyTerrance J. DishonghRakish AgarwalSirus Javadpour2 editions

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5 credited authorsSearch language english

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Michael Pecht
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F. Patrick McCluskey
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Terrance J. Dishongh
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Rakish Agarwal
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Sirus Javadpour
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