Electronic Packaging Materials and Their Properties
Work detail
Bookitis PickEP
Electronic Packaging Materials and Their Properties
Michael PechtF. Patrick McCluskeyTerrance J. DishonghRakish AgarwalSirus Javadpour3 editions
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Overview
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5 credited authorsSearch language english
Contributors
People credited with this work in the active catalog.
- Open Author
Michael Pecht
- Open Author
F. Patrick McCluskey
- Open Author
Terrance J. Dishongh
- Open Author
Rakish Agarwal
- Open Author
Sirus Javadpour
Editions
Publication-specific versions linked to this work only.
- EPElectronic Packaging Materials...Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour
Electronic Packaging Materials and Their Properties
- EPElectronic Packaging Materials...Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour
Electronic Packaging Materials and Their Properties
- EPElectronic Packaging Materials...Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour
Electronic Packaging Materials and Their Properties